2014
Export 5 million award, Certified as a venture company
Injection M-E/F (Real material pattern forming method)
Patent registration
2013
Multinational companies HP ( Hewlett-Packard ) Market entry
Export 3 million award
2012
Injection M-E/F (Injection pattern formation method) Three-patent application 中
2010
Optical Disk (torque and torsion detection sensors, optical disc manufacturing method) Patent registration
2009
Injection M-E/F (synthetic resin product surface pattern formation
method) Patent registration
Metal Pattern forming method Patent registration
2008
Knowledge Economy Department Metal material Surface Treatment and Pattern Implementation Technology subject of national policy Perform complete
2007
Patent application of manufacturing method for Poly Copper
electroforming plate ware.
Completed mass production of Ternary alloy
(passed ROHS standard)
2006
Certified as a Motorola partnership company
2005
electroforming, (Passed ROHS standard) - Completed 4 patent applications
2004
Established Tianjin Electronics (Co.) in China.
2003
Green partnership agreement contract of SONY
Certified as a partnership company of LG Electronics.
2002
Established China New Technology Corporation
Certified KSA-ISO 9002(Certified by : Korea productivity Center)
2000
Certified as a partnership company of pantech.
1995
Established Tsingtao Electronics (Co.) in China.
1994
Change of company name into daedong
1992
trading Registration(Registration number : 21010293)
production of BRAND BADGE, PIANO HINGE,FRONT PANEL
1988
Established Daidong Electronics (Co.), Mass