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  • 2014

    Export 5 million award, Certified as a venture company
    Injection M-E/F (Real material pattern forming method) Patent registration

  • 2013

    Multinational companies HP ( Hewlett-Packard ) Market entry
    Export 3 million award

  • 2012

    Injection M-E/F (Injection pattern formation method) Three-patent application 中

  • 2010

    Optical Disk (torque and torsion detection sensors, optical disc manufacturing method) Patent registration

  • 2009

    Injection M-E/F (synthetic resin product surface pattern formation method) Patent registration
    Metal Pattern forming method Patent registration

  • 2008

    Knowledge Economy Department Metal material Surface Treatment and Pattern Implementation Technology subject of national policy Perform complete

  • 2007

    Patent application of manufacturing method for Poly Copper electroforming plate ware.
    Completed mass production of Ternary alloy (passed ROHS standard)

  • 2006

    Certified as a Motorola partnership company

  • 2005

    electroforming, (Passed ROHS standard) - Completed 4 patent applications

  • 2004

    Established Tianjin Electronics (Co.) in China.

  • 2003

    Green partnership agreement contract of SONY
    Certified as a partnership company of LG Electronics.

  • 2002

    Established China New Technology Corporation
    Certified KSA-ISO 9002(Certified by : Korea productivity Center)

  • 2000

    Certified as a partnership company of pantech.

  • 1995

    Established Tsingtao Electronics (Co.) in China.

  • 1994

    Change of company name into daedong

  • 1992

    trading Registration(Registration number : 21010293)

  • 1988

    Established Daidong Electronics (Co.), Mass