

| Division | Electro-Forming | Electro-Plating |
|---|---|---|
| (Deposit Thickness | Several ㎛~several tens ㎜(Foil~Bulk) 0.1~0.3㎜(SRI-Tech Product) |
0.1~30㎛ (Coating) |
| Substrate Adhesion | To make easy exfoliation(separation) is important |
To make no exfoliation with high Substrate Adhesion is important. |











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Copper
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Metal having red gloss
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Non- allergy ( NI -> CU )
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High nobility logo & character realization by transfer of hologram.
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Various specifications to be realized on the surface of the products
(Hologram, corrosion feeling, Paper Hairline, Dia Hairline, gloss & mixing expressions of all these)
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Vivid characters & outline
- Realize high-class surface feeling & various designs of the existing Ni products.
- Ensure new technology without liquation of Ni component.
- Ensure reliability (By Samsung, Korea Testing & Research Institute, FITI and so on)
- Completion of the domestic patent application (Under preparation of the foreign patent)

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Cost reduction [Ensure cheap plating having the similar property of matter because of high price of Pd plating]
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Ensure reliability [Replace to plating cheaper than Pd with more reliability]
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Replace Pd plating to silver-white plating color.
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Non allergy reaction
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Superior throwing power & corrosion resistance.
: Like the general alloy plating, it has beautiful color and superior corrosion resistance because of uniform particles with almost no pores.
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Free to ROHS without containing of Pb brightener unlike the existing ternary alloy solution.
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Require AAS or CIP instruments for controlling solution.
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Have difficulty in controlling than single plating solution because solution changes color according to component content, current density & temperature.
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Have composition of Cupper (70%)+Tin (20%)+Zinc(10%)
